Site Navigation
Categories:
style guidelines
Integrated circuits
All articles with unsourced statements
Articles with unsourced statements since May 2007
Cleanup from January 2008
Wikipedia laundry list cleanup

Summary Of: Silicon chip

Encyclodia Page On: Silicon chip

These Are Links To Other Documents
Integrated circuit of Atmel Diopsis 740 System on Chip showing memory blocks, logic and input/output pads around the periphery | | Atmel | System on Chip | Microchips (EPROM memory) with a transparent window, showing the integrated circuit inside. Note the fine silver-colored wires that connect the integrated circuit to the pins of the package. The window allows the memory contents of the chip to be erased, by exposure to strong ultraviolet light in an eraser device. | | EPROM | ultraviolet light | electronics | electronic circuit | semiconductor devices | passive components | semiconductor | hybrid integrated circuit | semiconductor devices | vacuum tubes | semiconductor device fabrication | transistors | electronic components | mass production | photolithography | mm | mm | transistors | mm | Geoffrey W.A. Dummer | Ministry of Defence | Washington, D.C. | May 7 | 1952 | Jack Kilby | Texas Instruments | Robert Noyce | Fairchild Semiconductor | silicon | germanium | Siemens AG | amplifier | hearing aids | Jack Kilby | Kurt Lehovec | p-n junction isolation | Other variations of vacuum tubes | Loewe 3NF | Minuteman missile | Apollo program | Apollo guidance computer | citation needed | FM | television | Very-large-scale integration | Upper interconnect layers on an Intel 80486DX2 microprocessor die. | | Intel 80486 | VLSI | International Technology Roadmap for Semiconductors | Design tools | CMOS | Mead | Conway | RAM | Wafer-scale integration | System-on-a-Chip | Three Dimensional Integrated Circuit | The integrated circuit from an Intel 8742, an 8-bit microcontroller that includes a CPU running at 12 MHz, 128 bytes of RAM, 2048 bytes of EPROM, and I/O in the same chip. | | Intel | microcontroller | CPU | RAM | EPROM | I/O | microprocessors | computers | cellular phones | microwave ovens | memory chips | ASICs | information society | power | CMOS | Moore's law | nanometer | subthreshold leakage | high-k dielectrics | International Technology Roadmap for Semiconductors | Microchip revolution | Computers | cellular phones | digital | appliances | computing | communications | manufacturing | transport | Internet | scholars | digital revolution | microchip revolution | history | humankind | A CMOS 4000 IC in a DIP | | CMOS | 4000 | DIP | analog | digital | mixed signal | logic gates | flip-flops | multiplexers | microprocessors | DSPs | operational amplifiers | amplification | active filtering | demodulation | mixing | A/D converters | D/A converters | Semiconductor fabrication | Rendering of a small standard cell with three metal layers (dielectric has been removed). The sand-colored structures are metal interconnect, with the vertical pillars being contacts, typically plugs of tungsten. The reddish structures are polysilicon gates, and the solid at the bottom is the crystalline silicon bulk. | | standard cell | dielectric | semiconductors | periodic table | chemical elements | solid state | vacuum tube | William Shockley | Bell Laboratories | copper oxide | germanium | silicon | monocrystals | substrate | gallium arsenide | LEDs | lasers | solar cells | crystals | crystalline structure | Semiconductor | silicon | wafers | silicon on sapphire | gallium arsenide | Photolithography | doped | aluminum | CMOS | transistor | Resistive structures | Capacitive structures | inductive structures | gyrators | logic | states | bipolar | random access memory | microprocessor | light | waves | visible spectrum | photons | ultraviolet | electron microscopes | process | engineer | debugging | wafer testing | die | gold | welded | yielding | semiconductor | Intel | IBM | NEC | AMD | CPU | immersion lithography | Copper interconnects | Low-K | Silicon on insulator | Strained silicon | IBM | strained silicon directly on insulator | Integrated circuit packaging | dual in-line package | pin grid array | leadless chip carrier | Surface mount | small-outline integrated circuit | DIP | Small-outline integrated circuit | PLCC | PQFP | TSOP | microprocessors | land grid array | Ball grid array | printed circuit board | System In Package | Multi-Chip Module | programmable integrated circuits | logic gates | adders | registers | FPGAs | MEMS | DLP | projectors | inkjet printers | accelerometers | airbags | Atheros | X10 | Chip Art | | embedded lists | cleanup | style guidelines | encyclopedic | talk page | 555 | 741 operational amplifier | 7400 series | TTL | 4000 series | CMOS | Intel 4004 | microprocessor | MOS Technology 6502 | Zilog Z80 | home computers | Agere Systems | LSI Logic | Lucent | AT&T | Agilent Technologies | Hewlett-Packard | Alcatel | Altera | AMD | Analog Devices | ATI Technologies | Tseng Labs | Atmel | Broadcom | Commodore Semiconductor Group | Cypress Semiconductor | Fairchild Semiconductor | Traitorous Eight | Freescale Semiconductor | Motorola | Fujitsu | Genesis Microchip | GMT Microelectronics | Hitachi, Ltd. | Horizon Semiconductors | IBM | Infineon Technologies | Siemens | Integrated Device Technology | Intel | Intersil | Lattice Semiconductor | Linear Technology | LSI Logic | Maxim Integrated Products | Marvell Technology Group | Microchip Technology | MicroSystems International | MOS Technology | Mostek | National Semiconductor | Nordic Semiconductor | Nvidia | 3dfx | NXP Semiconductors | Philips | ON Semiconductor | Motorola | Parallax Inc. | PMC-Sierra | Renesas Technology | Hitachi | Mitsubishi Electric | Rohm | Samsung Electronics | STMicroelectronics | Texas Instruments | Toshiba | TSMC | u-blox | VIA Technologies | Formosa Plastics Group | Volterra Semiconductor | Xilinx | ZiLOG | Exxon | TPG | ISSCC | International Solid-State Circuits Conference | Custom Integrated Circuit Conference | ISCAS | International Symposium on Circuits and Systems | International Conference on VLSI Design | Design Automation Conference | International Conference on Computer-Aided Design | International Symposium on Physical Design | International Symposium on Quality Electronic Design | Design Automation and Test in Europe | International Electron Devices Meeting | Asia and South Pacific Design Automation Conference | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems | Clean room | Current mirror | Ion implantation | | Electronics portal | Computer engineering | Electrical engineering | MMIC | Hybrid integrated circuit | Printed circuit board | Integrated circuit vacuum tube | Integrated injection logic | Transistor–transistor logic (TTL) | Bipolar junction transistor | Emitter-coupled logic (ECL) | MOSFET | NMOS | CMOS | BiCMOS | BCDMOS | GaAs | SiGe | Mixed-signal integrated circuit | RC delay | Chip art | Memristor | Microcontroller | Moore's law | Semiconductor manufacturing | Simulation | Sound chip | SPICE | HDL | ZIF | Automatic test pattern generation | DatasheetArchive | Three-dimensional integrated circuit | ISBN 0-201-04358-0 | ISBN 0-07-228365-3 | ISBN 0-13-090996-3 | ISBN 1-59693-036-5 | ISBN 978-0-470-22941-5 | April 10 | 1962 | April 22 | 1959 | Scientific American | Wikimedia Commons | ISBN 1-59693-036-5 | J. S. Kilby | Applied Materials | v | d | Digital | Logic gate | digital circuit | Boolean logic | digital signal processing | computer architecture | Audio | Photography | Video | Categories | Integrated circuits | All articles with unsourced statements | Articles with unsourced statements since May 2007 | Cleanup from January 2008 | Wikipedia laundry list cleanup |
This article is licensed under the GNU Free Documentation License. It uses material from the Wikipedia article "Silicon chip".